MMBD301M3T5G
http://onsemi.com
3
PACKAGE DIMENSIONS
SOT?723
CASE 631AA
ISSUE D
DIM MIN NOM MAX
MILLIMETERS
A
0.45 0.50 0.55
b
0.15 0.21 0.27
b1
0.25 0.31 0.37
C
0.07 0.12 0.17
D
1.15 1.20 1.25
E
0.75 0.80 0.85
e
0.40 BSC
H
E
1.15 1.20 1.25
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
D
b1
E
2X
b
2X
e
A
3X
L
C
HE
?Y?
?X?
0.08
X
Y
1
2
3
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2
0.15 0.20 0.25
0.29 REF
3X
L2
1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
2X
0.40
1.50
PACKAGE
OUTLINE
2X
0.27
3X
0.52
0.36
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
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